LIDE®: Laser Induced Deep Etching for Precision Glass Micromachining
High-Quality Glass Microstructures Without Compromise
Why Industry Leaders Choose LIDE®
Unmatched Precision
Reach aspect ratios up to 1:50 and feature sizes down to 5 µm. Achieve razor-sharp accuracy in semiconductor packaging, microfluidics, and more.
Zero Defects
Eliminate micro-cracks, chipping, and thermal damage. Our two-step laser-and-etch approach delivers pristine surfaces for reliable performance.
High-Volume Efficiency
Scale your production with confidence. LIDE’s rapid throughput and automated control minimize costs without sacrificing quality.
Versatile Applications
From TGVs in advanced packaging to complex channels in lab-on-chip devices, one technology adapts to countless designs and industries.
Success Stories
“LIDE let us pack more I/O into a smaller package without a single chip-edge defect. Yields have never been higher.”
- Leading Semiconductor Manufacturer
“Zero cracks and precise alignment: exactly what we needed for our next-gen MEMS sensors. LIDE delivered on every front.”
- Global Electronics Innovator
“We created microfluidic chips with unmatched channel smoothness. LIDE has changed our entire product roadmap.”
- Biotech R&D Director
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