From Advanced Packaging to MEMS Fabrication, Microfluidics and More
Revolutionary Glass Processing for Next-Generation Products
Advanced Packaging
Elevate semiconductor manufacturing with Through Glass Vias (TGVs) and interposers built for high-density, high-frequency performance. Achieve aspect ratios up to 1:50 and microcrack-free surfaces for HPC, AI accelerators, and 5G modules.
Integrate memory stacks, GPU packages, or 2.5D/3D solutions without compromising on thermal management or signal integrity. LIDE ensures tight dimensional control and hermetic reliability at industrial-scale throughput.
MEMS & Sensor Packaging
Craft precise cavities, sealed sensor housings, and multi-level structures for everything from pressure sensors to RF MEMS devices. LIDE®’s glass modification process maintains the pristine surfaces needed for ultra-sensitive MEMS performance.
Design freer, more complex 3D profiles for inertial sensors, micro-mirrors, and optical MEMS. Enjoy robust mechanical stability and high-volume yield with minimal downtime.
Microfluidics & Lab-on-Chip
Create intricate channel networks, mixing chambers, and reaction zones with Ra < 0.1 µm sidewalls for superior flow control. LIDE fosters smooth edges critical for lab-on-chip assays and diagnostic platforms.
Push the boundaries of cell analysis, organ-on-chip technology, and advanced POCT devices through multi-level glass architectures free of stress fractures or material contamination.
Optical & Photonic Components
Sculpt waveguides, beam splitters, and micro-lens arrays in glass with near-perfect alignment and minimal scattering. LIDE® achieves optical-grade surfaces that preserve signal clarity in sensor arrays, telecommunication modules, and beyond.
Integrate complex 3D optical paths or refractive-index modifications without the risk of thermal distortion. Adapt for precision photonics packaging or next-gen AR/VR display elements.
Automotive & High-Reliability
Ensure sensor covers, ADAS modules, and display panels can handle tough conditions. LIDE® yields crack-free edges and consistent geometry for robust performance in safety-critical applications.
Enable automotive-grade glass solutions with advanced sealing and optical clarity. From curved display interfaces to LIDAR sensor glass, achieve faultless precision while meeting stringent reliability standards.
