Glass Core Substrates for Advanced Packaging
Ultra-Thin Glass Platforms for AI, HPC, and Chiplet Architectures
Core Building Blocks of Glass Core Substrates
Through-Glass Vias (TGVs)
TGVs form the backbone of glass substrates, enabling vertical electrical interconnections across the entire package. They connect redistribution layers on both sides of the substrate and support complex multi-die packaging architectures. For advanced packaging applications, TGVs must meet strict requirements including high aspect ratios, minimal sidewall defects, no microcracks in ultra-thin glass, and uniformity across large panels.
LPKF's LIDE® (Laser Induced Deep Etching) technology enables high-precision, high-density TGV formation while maintaining the structural integrity of thin glass substrates, ensuring reliable interconnect performance and consistent yield across advanced packaging platforms.
Defect free Glass Processing
Glass core substrates provide a mechanically rigid, panel-level stable backbone for advanced packages, typically at thicknesses of a few hundred micrometers. Their low, isotropic coefficient of thermal expansion (CTE) and high dimensional stability enable tight line/space, precise layer registration, and reliable high‑speed signal routing over large formats. At the same time, the glass core’s brittle nature means that microcracks, chipping, or subsurface damage introduced during pad opening, RDL modification, or rework can propagate and compromise long‑term reliability.
LPKF’s Tensor laser processing technology enables highly controlled, localized material removal with minimal thermal load and no mechanical contact, achieving defect‑free glass processing. This preserves the structural integrity and dielectric performance of glass core substrates while enabling precise ECOs and rework on high‑value semiconductor packaging panels.
Panel-Level Substrate Manufacturing
Glass enables scaling beyond wafer limitations, allowing large-panel processing for improved throughput and cost efficiency. Panel-level processing demands tight dimensional tolerances and consistent via formation across the full substrate area, both of which are essential prerequisites for high-yield advanced packaging production. Uniformity across large areas is non-negotiable to ensure performance consistency and minimize material waste at scale.
LPKF's systems are engineered to maintain processing precision and structural consistency at panel scale, supporting the industry's transition from wafer-level to panel-level semiconductor packaging manufacturing
Fine-Pitch Redistribution Layers (RDL)
In glass core substrates, fine‑pitch RDL is built directly on a stiff, low‑CTE glass core, enabling tight line/space and precise layer registration but making the structure very sensitive to defects at pad edges, via reveals, and outer routing layers especially before singulation, when microcracks or interface damage can propagate and impact yield.
LPKF’s Tensor Ablation uses controlled, contact‑free laser processing to selectively remove passivation and dielectric on glass cores with minimal thermal impact. This enables clean pad opening, precise RDL trimming, and localized rework without introducing stress points, helping prevent crack initiation and preserving fine‑pitch RDL integrity.
