Glass Interposers for Advanced Packaging
High-Density Redistribution Platforms for Chiplet and Optical Integration
Core Building Blocks of Glass Interposers
Blind Vias for High-Density Routing
Blind vias are a core structural element of glass interposers, enabling vertical electrical connections between redistribution layers while preserving the mechanical stability of the glass substrate. For advanced packaging, blind vias must meet strict requirements including precise depth control, smooth via rims for metallization, no microcracks or subsurface damage, and uniform via quality across large panels.
LPKF's LIDE® (Laser Induced Deep Etching) technology enables highly controlled formation of blind vias with chip-free via rims and precise geometries, supporting reliable metallization, high-density routing, and long-term package reliability across large-panel formats.
Ultra thin Glass Processing
Glass interposers combine ultra‑thin glass, dense TGVs, and fine‑pitch RDLs to deliver low‑loss, high‑speed routing for AI and HPC packages but these properties also make them highly sensitive to mechanical and thermal stress. As interposer thickness is driven down, even minor defects at the surface, around vias, or at the edges can impact handling robustness, yield, and long‑term reliability.
LPKF’s Tensor laser processing technology enables precise, damage‑free material removal on such ultra‑thin glass interposers, preserving surrounding glass and via integrity. This allows reliable pad opening, ECOs on high‑value interposer panels, and localized rework without inducing microcracks or chipping, ensuring the full performance and reliability benefits of glass interposers are maintained.
Photonic Microstructures
Glass interposers uniquely support the integration of optical structures directly within the substrate, enabling electrical-optical hybrid interconnect platforms for high-bandwidth computing systems. These structures include optical waveguides, fiber alignment grooves, optical coupling structures, and photonic cavities, all of which allow electrical and optical interconnects to coexist within the same package platform.
LPKF laser technologies enable the fabrication of these photonic microstructures with micrometer-level precision, supporting reliable integration of photonic components within advanced packaging platforms and paving the way for next-generation high-bandwidth system architectures.
