Cooling at the Source: In-Package Liquid Cooling for Next-Generation Chips
Precision laser processing for integrated microfluidic cooling in advanced packaging
Precision-Engineered Microfluidic Structures for In-Package Cooling
In-package liquid cooling depends on microfluidic structures that operate at micron scale while handling extreme thermal loads. Glass substrates offer a combination of properties that few materials can match: high chemical and thermal stability, smooth surface characteristics for controlled fluid behavior, and the ability to co-integrate electrical pathways such as Through-Glass Vias (TGVs) alongside microfluidic channels in a single platform. LPKF laser processing provides the fabrication precision these structures require, forming the foundation for high-performance cooling architectures integrated directly into advanced packaging interposers.
Ultra-Fine Microchannel Structuring
Low-micron channel dimensions
High positional accuracy across the full substrate
Dense microfluidic network layouts
Compatible with glass substrates, interposers, and panel formats
Efficient heat removal requires microchannels positioned directly at thermal hotspots. LPKF laser processing defines channel dimensions in the low-micron range with high positional accuracy, supporting dense microfluidic networks integrated into glass substrates and packaging interposers. Particularly relevant for AI processors, HPC systems, and chiplet architectures where heat concentration is most severe.
Smooth Channel Surfaces for Optimized Flow
Low sidewall roughness across channel profiles
Consistent performance in co-packaged optics and 3D integrated systems
Stable, predictable coolant flow behavior
Reduced pressure drop within the cooling network
Reliable coolant flow depends on internal surface quality. LPKF laser processing produces channel sidewalls with low roughness, reducing pressure drop and turbulence within the microfluidic network. This directly supports stable, consistent cooling performance in multi-die packages and co-packaged optics where flow uniformity across the channel network is critical.
High-Aspect Ratio Features and Complex Geometries
Deep, narrow channel profiles for high heat flux applications
Complex routing, branching, and manifold structures
Co-integration with Through-Glass Vias (TGVs) in a single substrate
Designed for compact, high-density package layouts
Advanced cooling designs demand deep channels in narrow footprints and flexible routing paths. LPKF laser processing supports high-aspect ratio microstructures and complex geometries, enabling microfluidic paths that run alongside or through electrical features such as TGVs. This co-integration within a single glass substrate is central to compact, high-density package designs where thermal and electrical functions must share the same physical space.
