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LIDE® Resource Center

Documentation, Guides,
and Expert Insights

Explore our LIDE® Resource Center

Your Knowledge Hub for Advanced Glass Microstructuring

Dive into our comprehensive library of technical documents, white papers, application notes, case studies, and more. Unlock the full potential of LIDE® technology with expert insights and hands-on resources.

 Brochures & Technical Documentation

Brochure S5000 Gen2 (pdf - 5 MB)
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Brochure M5000 Gen2 (pdf - 6 MB)
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 White Papers & Application Notes

TechPaper Laser Induced Deep Etching from LPKF (pdf - 2 MB)
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TechPaper Glass Structuring (pdf - 2 MB)
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Featured Publications

Advancing Semiconductor Packaging

The Role of LIDE Technology in Enhanced Glass Micro-Processing for More than TGV

Latest News & Insights

The Power of LIDE – Enabling the Future of High-Volume Semiconductor Manufacturing with Glass Substrates
LIDE enables defect-free Through Glass Vias and microstructures at scale — ideal for advanced packaging and semiconductor glass substrate production.
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The Importance of Partnerships for processing glass substrates: Building a Robust Supply Chain
Strong partnerships and process integration are key to scaling glass substrate technologies for semiconductor packaging. Learn how LPKF’s LIDE and its…
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More than simple through-hole plating – Why reliable TGV quality is crucial for mass production
LIDE delivers crack-free, high-precision TGVs — ensuring reliable, scalable glass substrate manufacturing for high-volume semiconductor production.
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More Than Just TGVs – LIDE Unlocks Unlimited Potential for Glass Structuring
LIDE goes beyond TGVs—unlocking precise, crack-free glass structuring for complex geometries in semiconductor applications, fluidics, MEMS, and…
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From Prototype to Production – How LPKF Bridges the Gap in TGV Manufacturing
LPKF’s LIDE bridges the gap from prototype to high-volume TGV manufacturing—delivering scalable, defect-free glass structuring with proven precision.
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Need More Information?

Our experts are ready to guide you through any technical documentation or provide further insights tailored to your application. From advanced packaging to microfluidics, we have you covered.

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