LIDE® Glass Processing Equipment: Advanced Laser Micromachining Systems
From R&D to High-Volume Production
System Portfolio
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LIDE M5000 Gen2
Perfect for R&D, Process Development, and Pilot Lines
Key Benefits
- Maximum flexibility
- Wafer and Panel Substrates
- Advanced process control
- Comprehensive quality monitoring
Processing Capabilities
Substrate Size Glass Thickness Minimum Feature Size Maximum Aspect Ratio Position Accuracy | Up to 515 x 510 mm 0.1 - 1.1 mm 5 µm 1:50 ±5 µm over 515 x 510 mm Panel |
Technical Specifications
System Features
Manual loading/unloading system
Integrated alignment system
Real-time process monitoring
Advanced quality control
Clean room compatibility
Production Metrics
24/7 operation capability
High throughput processing
Quick recipe changes
Comprehensive data logging
Process Development
Application consulting
Yield improvement
Custom solution development
Process optimization
Ideal Applications
Semiconductor Packaging
Through Glass Via (TGV) production
Interposer manufacturing
Advanced packaging solutions
MEMS Manufacturing
Cavity formation
Sensor packaging
Precision MEMS structures
LIDE S5000 Gen2
High Volume Production
Key Benefits
- Automated Wafer processing
- Rapid product changeover
- Flexible automation options
- Ideal for R&D and production
Processing Capabilities
Substrate Size Glass Thickness Minimum Feature Size Maximum Aspect Ratio | Up to 300 x 300 mm 0.1 - 1.1 mm 5 µm 1:50 |
Technical Specifications
System Features
Semi-automated operation
Quick setup capabilities
Process parameter flexibility
Integrated quality control
Recipe management system
Ideal Applications
R&D and prototyping
Specialized components
Process development
Small-batch production
