LIDE®
LIDE® M5000 Gen2

Perfect for R&D, Process Development, and Pilot Lines 

  • Maximum flexibility  
  • Wafer and Panel Substrates 
  • Advanced process control  
  • Comprehensive quality monitoring  

The Flagship System for Advanced Glass Panel Processing

Full Flexibility and Processing Capabilities

Experience the future of glass processing with the LIDE® M5000 Gen2: Engineered for semiconductor packaging with ±5 µm accuracy over a 515 x 510 mm panel, and comprehensive quality assurance. Achieve unprecedented throughput without compromising precision.

System Advantages

Superior Precision
  • ±5 µm positioning accuracy
  • Advanced alignment system
  • Real-time process control
Full Flexibility 
  • Manual loading/unloading
  • Wafer & Panel formats
  • Comprehensive data logging
Quality Assurance
  • Process monitoring
  • Pulse detection
  • Traceability system 

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