LPKF NEXAR Ablate 5000 – Precision RDL Ablation Without Yield Loss
The LPKF NEXAR Ablate 5000 is the dedicated production system for glass core substrate singulation and edge preparation in advanced packaging. It uses Tensor Ablation, a proprietary ultra-short pulse laser process to selectively remove copper RDL and build-up dielectrics such as ABF while leaving the glass substrate completely intact. Where conventional ablation methods introduce microdamage, thermal stress, and hidden SeWaRe defects that split glass internally, NEXAR Ablate 5000 stops SeWaRe at its source. The result is clean, defect-free edges, robust substrates, and significantly higher yield across panel-level fan-out, glass core packages, and high-density interposers.
Technical Data
| NEXAR Ablate 5000 M | NEXAR Ablate 5000 S | NEXAR Ablate 5000 P | |
|---|---|---|---|
| Max. substrate format | 515 mm x 510 mm* | <300 mm* | 515 mm x 510 mm* |
| Substrate type | Multi Format (Panels & Wafers) | Glass wafers | Glass panels |
| Laser Type | Ultra-short pulse (ps/fs) | Ultra-short pulse (ps/fs) | Ultra-short pulse (ps/fs) |
| Wavelength | Optimized for RDL selectivity | Optimized for RDL selectivity | Optimized for RDL selectivity |
| Positioning accuracy | Sub-micron range | Sub-micron range | Sub-micron range |
| Edge quality | Minimal heat-affected zone | Minimal heat-affected zone | Minimal heat-affected zone |
| Process monitoring | Optional | Standard | Standard |
| Automation level | Manual loading | Automated wafer handling | Automated panel handling |
| Production uptime | Designed for 24/7 operation | Designed for 24/7 operation | Designed for 24/7 operation |
| Footprint | Compact cleanroom footprint | Compact cleanroom footprint | Compact cleanroom footprint |
*Exact sizes configurable depending on system configuration
Available Variants
| Variant | Substrate format | Handling / Automation | Typical application focus |
|---|---|---|---|
| NEXAR Ablate 5000 M | Multi format (Wafers & Panels) | Manual loading | Process development, R&D, low-volume production |
| NEXAR Ablate 5000 S | Glass Wafers | Automated semiconductor handling | Wafer-level glass cores, interposers, carriers |
| NEXAR Ablate 5000 P | Glass Panels | Fully automated panel handling | Panel-level fan-out, glass cores, mass production |
NEXAR Ablate 5000 – Redefining RDL Ablation on Glass
The most efficient solution for damage‑free glass core singulation
The LPKF NEXAR Ablate 5000 brings Tensor Ablation into production, delivering selective RDL and dielectric removal with zero substrate microdamage. By preventing the SeWaRe effect at its source, the system enables clean, defect‑free edges and preserves the full mechanical integrity of glass cores throughout downstream processing. Whether used for glass core substrates, panel‑level fan‑out, or high‑density glass interposers, NEXAR Ablate 5000 combines ultra‑short pulse laser technology, high material selectivity, and real‑time process monitoring to provide reliable, high‑yield RDL ablation for advanced packaging.
