LPKF NEXAR Bond 5000 – Fast. Robust. Permanent.
The LPKF NEXAR Bond 5000 brings Tensor Bonding into high-volume manufacturing. By using advanced laser welding instead of adhesives, frits, or high-temperature furnace processes, it creates strong, permanent glass-to-glass bonds at panel level.
Proprietary high-speed beam deflection technology generates an extended weld pool between glass substrates, enabling direct fusion with an exceptionally low thermal budget and high-speed, freeform bonding paths. The process bridges single-digit micrometer gaps, compensates TTV and particle contamination, and maintains substrate temperature close to room level, fully compatible with delicate LIDE microstructures and pre-assembled components.
Technical Data
| NEXAR Bond 5000 M | NEXAR Bond 5000 S | NEXAR Bond 5000 P | |
|---|---|---|---|
| Bonding principle | Laser-based Tensor Bonding | ||
| Substrate format | Multi Fomat (Wafer & Panel) | Wafers | Panels |
| Typical substrate size | 515 mm x 510 mm | <300 mm | 515 mm x 510 mm |
| Substrate thickness | 100 µm to >6 mm | 100 µm to >6 mm | 100 µm to >6 mm |
| Throughput | Up to 600–2000 mm bond line per minute* | Up to 600–4000 mm bond line per minute* | Up to 600–4000 mm bond line per minute* |
| Bonding speed | Up to 200 mm/s (application-dependent) | ||
| Bond seam width | Approx. 50 µm (configurable) | Approx. 50 µm (configurable) | Approx. 50 µm (configurable) |
| Handling / Automation | Manual loading | Automated wafer handling | Automated panel handling |
| Alignment accuracy | < 5 µm (integrated vision system) | < 5 µm (integrated vision system) | < 5 µm (integrated vision system) |
| Cleanroom compatibility | Class 1000 or better (ISO 5–6) | Class 1000 or better (ISO 5–6) | Class 1000 or better (ISO 5–6) |
| Typical use case | Process development, demos, pilot / low-volume production | Wafer-level glass caps, MEMS/IC & photonic packaging | Panel-level multi-layer glass cores & co-packaged optics |
* Throughput depends on panel/wafer size, bond line length, and layout.
Available Variants
| Variant | Substrate format | Handling / Automation | Typical application focus |
|---|---|---|---|
| NEXAR Bond 5000 M | Multi Fomat (Wafers & Panels) | Manual loading | Process development, R&D, low-volume production |
| NEXAR Bond 5000 S | Glass Wafers | Automated semiconductor handling | Wafer-level glass cores, interposers, carriers |
| NEXAR Bond 5000 P | Glass Panels | Fully automated panel handling | Panel-level fan-out, glass cores, mass production |
NEXAR Bond 5000 – Tensor Bonding for 3D Glass Integration
The fastest, adhesive‑free solution for precision glass‑to‑glass bonding in advanced packaging
NEXAR Bond 5000 turns glass‑to‑glass bonding into a fast, clean, and fully production‑ready step for advanced packaging. Tensor Bonding uses high‑speed laser beam deflection to fuse glass directly, creating continuous weld seams that bridge single‑digit micrometer gaps and tolerate real‑world TTV and ISO‑6 particle levels. Because heating is highly localized, the bulk substrate stays near room temperature, so bonds can be placed right next to LIDE‑structured vias, cavities, and pre‑assembled components without warpage or damage.
The result is adhesive‑free, contamination‑free joints with long‑term stability and ultra‑low WVTR, formed at hundreds of millimeters per second along any programmed path. NEXAR Bond 5000 provides the bonding backbone for multi‑layer glass cores, co‑packaged optics, microfluidics, and high‑reliability sensor and RF packages.
