System Portfolio
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NEXAR LIDE 5000 M
Perfect for R&D, Process Development, and Pilot Lines
Key Benefits
- Maximum flexibility
- Wafer and panel substrates
- Advanced process control
- Comprehensive quality monitoring
Processing Capabilities
Substrate Size Glass Thickness Minimum Feature Size Maximum Aspect Ratio Position Accuracy | Up to 515 mm x 510 mm 0.1 - 1.1 mm 5 µm 1:50 ±5 µm over 515 mm x 510 mm Panel |
Technical Specifications
System Features
Manual loading/unloading system
Integrated alignment system
Real-time process monitoring
Advanced quality control
Clean room compatibility
Production Metrics
24/7 operation capability
High throughput processing
Quick recipe changes
Comprehensive data logging
Process Development
Application consulting
Yield improvement
Custom solution development
Process optimization
Ideal Applications
Semiconductor Packaging
Through Glass Via (TGV) production
Interposer manufacturing
Advanced packaging solutions
MEMS Manufacturing
Cavity formation
Sensor packaging
Precision MEMS structures
NEXAR LIDE 5000 S
High Volume Production
Key Benefits
- Automated Wafer processing
- Rapid product changeover
- Flexible automation options
- Ideal for R&D and production
Processing Capabilities
Substrate Size Glass Thickness Minimum Feature Size Maximum Aspect Ratio | Up to 300 x 300 mm 0.1 - 1.1 mm 5 µm 1:50 |
Technical Specifications
System Features
Semi-automated operation
Quick setup capabilities
Process parameter flexibility
Integrated quality control
Recipe management system
Ideal Applications
R&D and prototyping
Specialized components
Process development
Small-batch production
NEXAR LIDE 5000 P
Optimized for High‑Volume Panel‑Level Production
Key Benefits
- HVM panel‑level processing of 515 mm × 510 mm
- ~1.5× higher throughput vs. LIDE M5000 Gen2
- Full EFEM and SECS/GEM integration for automated fabs
- Advanced in‑line process monitoring
- LiftPin table with sag compensation for safe handling of warped panels
Processing Capabilities
Substrate Size Glass Thickness Minimum Feature Size Maximum Aspect Ratio Position Accuracy | 515 mm x 510 mm 0.2 - 1.1 mm 5 µm 1:50 ±5 µm over 515 mm x 510 mm Panel |
Technical Specifications
System Features
- EFEM‑ready process module based on an industry‑proven machine platform
LiftPin table with12 separately controllable pins for safe handling of large panels
Sag compensation up to 6 mm (LiftPin stroke 48 mm)
Inline beam position control, sequential beam profile measurement, and pulse monitoring
Clean room compatibility
Production Metrics
24/7 high‑volume panel‑level operation capability
1.5 x High throughput processing
Quick recipe changes
Comprehensive data logging
Process Development
Application consulting for panel‑level TGV and glass core substrate design
Yield improvement through optimized LIDE process windows
Custom integration with EFEM and fab host systems (SECS/GEM)
Process optimization HVM glass interposers and related advanced packaging applications
Ideal Applications
Panel‑Level Glass Core Substrates
- High‑volume TGV formation on 515 mm × 510 mm glass panels
Panel‑level interposers and chiplet integration substrates
Advanced packaging solutions for HPC and AI on glass
High‑Density Glass Structures in HVM
Large‑area TGV arrays with tight form and diameter tolerances
Panel‑scale microstructured glass for advanced packaging lines
Yield‑critical HVM environments requiring ppm‑level defect rates and stable EFEM automation
