The Foundation Every Glass Packaging Architecture Builds On. 

NEXAR LIDE systems form through-glass vias, blind vias, cavities, and complex glass microstructures on substrates of 515 mm × 510 mm with the accuracy and yield consistency that production packaging lines require.


What the system delivers:

• Via diameters down to 5 µm, aspect ratios up to 1:50
   
• Sidewall roughness Ra < 0.1 µm across the full substrate area
   
• Positional accuracy ±5 µm on panels of 515 mm× 510 mm
   
• NG rates below 5 ppm at production yield
   
• Single-shot processing of glass thicknesses from 0.2 to 1.1 mm

Beyond TGVs, the same system handles blind glass vias, microfluidic channels, optical V-grooves, precision cavities, dicing streets, and multi-level 2.5D structures all on one substrate, in one process step. No mechanical contact, no thermal damage, no re-tooling between feature types.  

Glass-to-Glass Bonding. Fast. Robust. Permanent.

NEXAR Bond systems fuse glass substrates directly to each other at production speed, on panels of 515 mm × 510 mm, with the thermal budget and contamination control that advanced packaging architectures demand.


What the system delivers:

•    Bonding speeds up to 250 mm/s along freeform programmable paths

•    Gap bridging up to 15 µm tolerates TTV variation and ISO Class 6 particles

•    50 µm bond seam width with alignment accuracy below 5 µm

•    Bulk substrate stays at room temperature throughout adjacent LIDE features unaffected

•    600–4,000 mm bond line per minute throughput at panel scale

•    >90% uptime, ISO Class 5-6 cleanroom compatible


The system bonds around features —TGVs, cavities, and embedded components without full-area thermal exposure. No cool-down cycle between substrates. No adhesive curing time. No outgassing risk. Seam contraction can generate controlled inter-layer forces, supporting direct glass core electrical contact architectures without additional interconnect steps.