LIDE® Technology: Industry Standard for Advanced Glass Processing
Outperforming Traditional Glass Processing Methods
The Two-Step Process
LIDE® fuses ultrafast laser modification with selective wet etching to create through-holes, channels, and complex 2.5D forms in glass— all without micro-cracks or thermal damage.
First, a precise laser pulse “marks” the glass structure without removing any material. Then, a rapid etching bath erases these modified zones, leaving pristine shapes that maintain the glass’s inherent strength.
Laser Modification
Ultrafast pulses define each feature with sub-micron accuracy. No heat-affected zone means exact control over depth, diameter, and complex geometries from TGV arrays to custom microfluidic ports.
This step sets the stage for zero-defect edges and wafer-level consistency, bridging R&D concepts to mass production.
Advanced Wet Etching
Modified glass regions dissolve quickly, leaving pristine, smooth surfaces. Precision chemical balances ensure each structure like vias or channels meets tight dimensional tolerances while retaining overall glass integrity.
Batch processing scales effortlessly, making high-volume output a reality for even the most intricate designs.
Key Advantages
Defect-Free Structures
Say goodbye to micro-cracks and chipping. LIDE® preserves glass strength for robust, reliable devices.
High Aspect Ratios
Achieve up to 1:50 aspect ratios for TGVs and next-gen packaging without compromising accuracy.
Scalable Throughput
Laser modification plus batch etching equals rapid production for advanced packaging, MEMS, and sensor markets.
Versatile Designs
Carve out vias, microchannels, or 3D optical paths—all in a single, controllable process that suits any glass composition.
Building Blocks
TGVs (Through Glass Vias)
Metallized TGVs for electrical or thermal connections.
High aspect ratio, multi level glass components
Fine glass structures with multiple depth level on one substrate in one process step with full design freedom.
Spacer
Creating precise distances between stacked glass chips.
Corrugated Glass Membranes
Corrugated Glass membranes with thicknesses <5µm are used as highly flexible spring structure, as electric isolation in micro fluidic application or serve to decouple surface tension.
V-Grooves
High-precision V-grooves for the positioning of optical fiber arrays.
Chamfered Edges
Customer-specific chamfered outer edges or cut-outs.
Micro-Spring-Structures
Highly flexible micro spring elements with breaking strengths of up to 1GPa.
Dicing Streets/Grooves
High precision dicing streets for controlled chip separation and accurate dimensions.
Micro-Fluidic Channels
High precision micro fluidic structures in glass.
Cavities
Custom-designed cavities for functional integration and component housing.
Technical Highlights
Minimize TGV sidewall roughness (Ra < 0.1 µm), control via diameters down to 5 µm, and ensure ±1 µm positional accuracy over 515x510 mm panels.
Benefit from the full potential of glass by leveraging its advantages like the tunable CTE, strength, flatness, electrical properties, and more with our defect free processing technology.
Why Glass?
Glass outperforms silicon in RF performance, thermal stability, and transparency for photonic or sensor applications. LIDE® unleashes these benefits by removing the usual micro-crack pitfalls.
Whether you need wafer-level interposers or curved display covers, glass offers unmatched chemical and mechanical resilience once processed with LIDE’s defect-free approach.